2012 infrared led
OVERVIEW
PERFORMANCE
Parameter | Symbol | Rating | Units |
Continuous Forward Current | IF | 30 | mA |
Peak Forward Current | IFP | 180 | mA |
Reverse Voltage | VR | 5 | V |
Operating Temperature | Topr | -40 ~ +85 | ℃ |
Storage Temperature | Tstg | -40 ~ +85 | ℃ |
Soldering Temperature | Tsol | 260 | ℃ |
Power Dissipation at(or below) 25℃Free Air Temperature | Pd | 100 | mW |
PRODUCT
Product performance of 20ma Queendom 2012 Architectural at specified test conditions.
Product No. | Emitted Color | Power/W | Wavelenght(nm) | IF(mA) TEST | Ee(mW/sr) | CRI | VF (V) Typ. | Reverse current(µA) | deg 2Ө 1/2 | Lens Type | Part No. |
2012I3DCA | IR | 0.06 | 936-948 | 20 | 0.4-1.6 | / | 1.2-1.8 | ≤10 | 130±5° | Clear | 8541401000THLIL19 |
2012I3DCB | IR | 0.06 | 845-880 | 20 | 0.4-1.6 | / | 1.2-1.8 | ≤10 | 130±5° | Clear | 8541401000THLIL20 |
FEATURES
Main chips: Optoelectronics (ED), Tyntek, Japan Dowa, Epistar
Chip specifications: Dimensions are 8*8mi 9*9mil 10*10mil 12*12mil
Power factor: 0.06-0.1w
Gold plate material: pure gold-plated PCB sheet, (transparent colloid).
Silver plate material: pure silver-plated PCB sheet, (transparent colloid)
Light-emitting method: single-color light-emitting, double-color light-emitting, etc.
Packaging method: front/reverse packaging, 3K, 4K, etc.
BENEFITS
2012 infrared led Compact size
Packaged with 8mm tape on 7″ diameter reel
Compatible with automatic placement equipment
Compatible with infrared and vapor phase reflow soldering processes
APPLICATION
940mm suitable for remote controls, such as remote controls for household appliances
850mm suitable for cameras (video shooting) digital photography, surveillance, building intercoms, explosion-proof
Infrared communication, infrared remote control, security monitoring, photoelectric sensors, infrared thermal imaging, QUEENDOM can provide infrared emission tubes with various packaging structures